According to the characteristics of copper material and high requirements of the 3C fabricate, Kona nano alumina water-based copper cmp slurry provides a good surface finish with no compromise on the polishing rate.

Polishing Slurry for 3C Copper Accessories

1

Copper is a soft metal (Mohs hardness 3), and it is a highly reactive metal and it oxidized very easily. That increases the difficulty of polishing Copper Accessories for computer and mobile phone.

2

Our cu cmp slurry is designed for the 3C Copper Accessories polishing process (which is mostly a CMP process ), it is a water-based nano alumina polishing slurry added an additive special for the characteristic of copper.

3

Kona Copper Polishing Slurry provides a mirror-like surface finish with no compromise on removal rate, and also can achieve a good gloss value, such as hundreds gu.

DETAILS OF COPPER POLISHING SLURRY

Copper has good electrical conductivity, thermal conductivity and corrosion resistance, low hardness, strong ductility and good gloss, and is widely used in 3C industry, especially in various mobile phone accessories.

Copper polishing has not only the requirements of flatness and roughness, but also the requirements of glossiness.

Kona provide both nano alumina based and silica colloidal based polishing slurry for copper accessories.

For more information about colloidal silica, please feel free to contact us!